Doctor | University of Electronic Science and Technology of China | China
Dr. Qingfeng Zhang is a dedicated researcher at the University of Electronic Science and Technology of China, contributing significantly to the rapidly advancing fields of millimeter-wave engineering, silicon-based phased arrays, and next-generation integrated circuit technologies. With a body of 38 publications and over 100 citations, his work reflects both technical depth and sustained scholarly influence. His research focuses on high-frequency system design, advanced CMOS on-chip antennas, and innovative 3D packaging architectures, emphasizing improved circuit modeling, miniaturization, and performance optimization for emerging communication systems. Dr. Zhang’s studies on silicon-based millimeter-wave integrated phased arrays and device-to-system modeling address foundational engineering challenges that are critical to the development of 5G, 6G, and high-speed sensing technologies. His contributions to improved equivalent circuit models, high-gain compact D-band antennas, and enhanced interconnection structures demonstrate his commitment to bridging theoretical modeling with practical device implementation. Collaborating with more than 80 international and domestic co-authors, he is actively engaged in multidisciplinary research that advances semiconductor reliability, packaging innovation, and electromagnetic design. His work not only supports the academic community but also carries significant societal impact by informing the development of faster, more efficient, and more reliable wireless systems that underpin modern communication infrastructures. With an h-index of 6 and growing recognition within the engineering research community, Dr. Zhang continues to build a strong scholarly profile centered on technological innovation, collaborative inquiry, and practical solutions to next-generation communication challenges.
Featured Publications
1. Zhang, Q., Liu, H., Yu, Y., Wu, Y., Zhao, C., Zhang, J., & Kang, K. (2025). Developments and challenges of silicon-based millimeter-wave integrated phased arrays: System, circuit, and device modeling. Science China Information Sciences, 68, Article 1914015.
2. Li, Y., Zhang, Q., Tang, H., Yang, Y., & Kang, K. (2025, May). A D-band CMOS on-chip antenna with high gain and miniaturization. In Proceedings of the 2025 IEEE MTT-S International Wireless Symposium (IWS) (conference paper).
3. Liu, Y., Wang, H., et al. (2025, May). Improved equivalent circuit model of BGA and RDL combined interconnection for 3D packaging. In Proceedings of the 2025 IEEE MTT-S International Wireless Symposium (IWS). Cited by: 1)
Dr. Qingfeng Zhang’s work in silicon-based millimeter-wave integrated phased arrays and advanced 3D packaging technologies is advancing the next generation of high-frequency communication, sensing, and semiconductor innovation. His contributions strengthen the scientific foundation for faster, more efficient, and scalable wireless systems, supporting progress in global connectivity, smart industries, and emerging 6G technologies.